{"text_format":"1","workbook":"xlsx","n_sheets":2,"sheets":["form(Warranty)","manual(Warranty)"],"not_rendered":{"charts":0,"images":1,"macros":1,"external_links":0,"defined_names":6,"comments":0,"pivot_tables":0},"unopened":[],"bounds":{"document_bytes":16777216,"sheet_cells":100000,"rows_first":2000,"rows_last":500,"rows_between":2000,"halvings":0,"cell_chars":16384,"cell_head_chars":4096},"cells_cut":0,"cells_raw":0,"read":"whole","date_system":"1900"}

{"sheet":"form(Warranty)","index":0,"n_rows":120,"n_cols":25,"rows_kept":120,"cut":false,"hidden":false,"merged":[[112,1,112,24],[90,19,91,19],[108,3,108,18],[104,1,104,2],[104,3,104,18],[104,20,104,22],[81,3,81,18],[83,1,83,2],[84,1,84,2],[83,20,83,22],[84,20,84,22],[109,1,109,2],[114,1,114,24],[113,1,113,24],[110,1,110,2],[110,20,110,22],[107,1,107,2],[107,20,107,22],[109,20,109,22],[110,3,110,18],[90,1,91,2],[91,3,91,18],[90,20,91,22],[94,3,94,18],[107,3,107,18],[94,1,94,2],[94,20,94,22],[93,1,93,2],[93,3,93,18],[93,20,93,22],[109,3,109,18],[90,3,90,18],[105,3,105,18],[106,20,106,22],[105,20,105,22],[92,1,92,2],[117,1,117,24],[105,1,105,2],[108,1,108,2],[116,1,116,24],[23,8,23,17],[24,8,24,17],[1,1,1,26],[43,5,43,18],[33,2,33,8],[29,9,29,17],[30,9,30,17],[39,2,39,8],[34,2,34,8],[35,2,35,8],[30,2,30,8],[3,24,3,25],[3,22,3,23],[6,2,6,11],[3,20,3,21],[31,9,31,17],[33,9,33,17],[29,2,29,8],[43,3,43,4],[29,18,29,25],[23,2,23,7],[22,2,22,7],[25,8,25,17],[62,1,62,4],[62,5,62,14],[59,5,61,14],[21,2,21,7],[30,18,39,25],[21,8,21,17],[22,8,22,17],[58,5,58,14],[36,9,36,17],[39,9,39,17],[57,5,57,14],[50,2,54,23],[57,1,57,4],[58,1,58,4],[59,1,61,4],[37,9,37,17],[37,2,37,8],[25,2,25,7],[24,2,24,7],[35,9,35,17],[31,2,31,8],[108,20,108,22],[65,1,65,4],[95,1,95,2],[95,3,95,18],[95,20,95,22],[81,1,81,2],[82,3,82,18],[106,1,106,2],[106,3,106,18],[82,1,82,2],[85,1,85,2],[86,1,86,2],[87,1,87,2],[82,20,82,22],[79,1,79,2],[79,3,79,18],[78,1,78,2],[80,3,80,18],[78,20,78,22],[80,20,80,22],[78,3,78,18],[92,3,92,18],[92,20,92,22],[81,20,81,22],[32,2,32,8],[36,2,36,8],[32,9,32,17],[38,2,38,8],[34,9,34,17],[76,3,76,18],[63,1,63,4],[77,20,77,22],[77,1,77,2],[64,5,64,14],[64,1,64,4],[38,9,38,17],[63,5,63,14],[77,3,77,18],[65,5,65,14],[76,20,76,22],[76,1,76,2],[79,20,79,22],[88,1,88,2],[89,1,89,2],[83,3,83,18],[84,3,84,18],[85,3,85,18],[86,3,86,18],[87,3,87,18],[88,3,88,18],[89,3,89,18],[85,20,85,22],[86,20,86,22],[87,20,87,22],[88,20,88,22],[89,20,89,22],[80,1,80,2]]}
[null,"<Steps for Creation>"]
[null,"(1) See the Manual in the separate sheet and enter the data → (2) Run Check Entry below to confirm → (3) Print Warranty"]
[]
[]
[]
[]
[null,"To","PFU Limited"]
[]
[]
[null,null,null,null,null,null,null,null,null,null,null,"Warranty of Compliance with PFU’s Requirement for Chemical Substance (Rev.17L02)"]
[]
[]
[null,"We hereby declare and warrant that  we comply with PFU Limited (\"PFU\")'s Group Standard in supplying PFU Group below listed Product, "]
[null,"even if the Product is altered in any elements as far as the Product remains the same in name and part number."]
[]
[]
[null,"We agree that for the purpose of the above warranty, the terms are defined as follows:"]
[]
[]
[null,"1. PRODUCT"]
[]
[null,null,"Survey ID:"]
[null,null,"PFU Group Product Number:"]
[null,null,"Product Name:"]
[null,null,"Manufacturer's P/N  [* Reference]:"]
[null,null,"Manufacturer's Name  [* Reference]:"]
[]
[null,"2. PFU’S GROUP STANDARD"]
[]
[null,null,"RESTRICTED SUBSTANCES",null,null,null,null,null,null,"THRESHOLD",null,null,null,null,null,null,null,null,"REMARK"]
[null,null," (1) Lead and its compounds",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm",null,null,null,null,null,null,null,null,"Make sure to enter exempted applications in the Item 3."]
[null,null," (2) Mercury and its compounds",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (3) Cadmium and its compounds",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 100 ppm"]
[null,null," (4) Hexavalent chromium compounds",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (5) Polybrominated biphenyls (PBBs)",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (6) Polybrominated diphenyl Ethers (PBDEs)",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (7) Bis(2-ethylhexyl) phthalate (DEHP)",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (8) Butyl benzyl phthalate (BBP)",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (9) Dibutyl phthalate (DBP)",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (10) Diisobutyl phthalate (DIBP)",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[]
[null,"3. EXEMPTED APPLICATIONS (See Appendix)"]
[]
[null,null,null,"Exempted Applications"]
[]
[null,null,null,null,null,"↑Select the cell and double click → the Configuration window opens to enter data. No entry is considered to be no exemptions."]
[null,null,null,null,null,"　 * Direct entry is available. See the Configuration Sheet and the note below."]
[null,null,null,null,null,"　　　・Use half-width alphanumeric. Separate applications with a half-width comma (,) if there is more than one."]
[null,"4. REMARKS"]
[]
[]
[]
[]
[]
[]
[]
[]
[null,"Date (M/D/Y):"]
[null,"Person responsible:"]
[null,"Signature: "]
[]
[]
[null,"Department:"]
[null,"Company:"]
[null,"Phone:"]
[null,"E-mail:"]
[]
[]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"[1/3page]"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," 2026/5/25 form"]
[]
[null,"Appendix. EXEMPTED APPLICATIONS FROM CONTAINMENT RESTRICTION (REFERENCE LIST)"]
[]
[null,null,"The following table is quoted from the Official Journal of the European Union."]
[null,null,"For any exempted applications other than below, see the Official Journal."]
[]
[null,"No.",null,"EXEMPTED APPLICATIONS FROM CONTAIMENT RESTRICTION",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Ｐｂ","Ｃｄ"]
[null,"5(b)",null,"Lead in glass of fluorescent tubes not exceeding 0,2 % by weight",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"6(a)-I",null,"Lead as an alloying element in steel for machining purposes containing up to 0,35 % lead by weight",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"6(a)-II",null,"Lead as an alloying element in batch hot-dip galvanised steel components containing up to 0,2 % lead by weight",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"6(b)-III",null,"Lead as an alloying element in aluminium casting alloys containing up to 0,3 % lead by weight provided it stems from lead-bearing aluminium scrap recycling",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"6(c)",null,"Copper alloy containing up to 4 % lead by weight",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)",null,"Lead in high melting temperature type solders \n(i.e. lead-based alloys containing 85 % by weight or more lead)",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-I",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) for internal interconnections for attaching die, or other components along with a die in semiconductor assembly with steady state or transient/impulse currents of 0,1A or greater or blocking voltages beyond 10V, or die edge sizes larger than 0,3mm × 0,3mm",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-II",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) for integral (meaning internal and external) connections of die attach in electrical and electronic components, if all the following conditions are met:\n- the thermal conductivity of the cured/sintered die-attach material is > 35W/(m × K),\n- the electrical conductivity of the cured/sintered die-attach material is > 4,7MS/m,\n- solidus melting temperature is higher than 260°C",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-III",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) in first level solder joints (internal or integral connections - meaning internal and external) for manufacturing components so that subsequent mounting of electronic components onto subassemblies (i.e. modules, sub-circuit boards, substrates, or point-to-point soldering) with a secondary solder does not reflow the first level solder. This sub-entry excludes die attach applications and hermetic sealings",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-IV",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) in second level solder joints for the attachment of components to printed circuit board or lead frames:\n(1)in solder balls for the attachment of ceramic ball-grid- array (BGA);\n(2)in high temperature plastic overmouldings (> 220°C)",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-V",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) as a hermetic sealing material between:\n(1)a ceramic package or plug and a metal case;\n(2)component terminations and an internal sub-part",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-VI",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) for establishing electrical connections between lamp components in incandescent reflector lamps for infrared heating, high intensity discharge lamps, or oven lamps",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-VII",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) for audio transducers where the peak operating temperature exceeds 200°C",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(c)-I",null,"Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, ",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"e.g. piezoelectronic devices, or in a glass or ceramic matrix compound"]
[null,"7(c)-II",null,"Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(c)-V",null,"Electrical and electronic components containing lead in a glass or glass matrix compound that fulfils any of the following functions: 1) for protection and electrical insulation in glass beads of high-voltage diodes and glass layers for wafers ;2) for hermetic sealing between ceramic, metal and/or glass parts; 3) for bonding purposes in a process parameter window for < 500 °C combined with a viscosity of 1013.3 dPas (‘glass-transition temperature’); 4) for use as a resistive material such as ink, with a resistivity range from 1 ohm/square to 100 megohm/square, excluding trimmer potentiometers; 5) for use in chemically modified glass surfaces for microchannel plates (MCPs), channel electron multipliers (CEMs) and resistive glass products (RGPs).",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(c)-VI",null,"Electrical and electronic components containing lead in a ceramic that fulfils any of the following functions: 1) for use in piezoelectric lead zirconium titanate (PZT) ceramics; 2) for providing ceramics with a positive temperature coefficient (PTC).",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"8(b)-I",null,"Cadmium and its compounds in electrical contacts used in: \n  - circuit breakers, \n  - thermal sensing controls, \n  - thermal motor protectors (excluding hermetic thermal motor protectors), \n  - AC switches rated at: \n        - 6 A and more at 250 V AC and more, or \n        - 12 A and more at 125 V AC and more, \n  - DC switches rated at 20 A and more at 18 V DC and more, and \n  - switches for use at voltage supply frequency ≥ 200 Hz.",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"Continued on next page"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"[2/3page]"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," 2026/5/25 form"]
[]
[]
[]
[]
[]
[null,"No.",null,"EXEMPTED APPLICATIONS FROM CONTAIMENT RESTRICTION",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Ｐｂ","Ｃｄ"]
[null,"13(a)",null,"Lead in white glasses used for optical applications",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"13(b)-(I)",null,"Lead in ion coloured optical filter glass types",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"13(b)-(II)",null,"Cadmium in striking optical filter glass types; excluding applications falling under point 39 of this Annex\n* Exclusion number 39 (Excluded unused in this regulation): Cadmium included in color conversion II - VI compound semiconductor LED\n   (cadmiumper mm2 of light emitting area <10 μg) for illumination or display system applications.",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"13(b)-(III)",null,"Cadmium and Lead in glazes used for reflectance standards",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●","●"]
[null,"15(a)",null,"Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit \nflip chip packages where at least one of the following criteria applies: \n  - a semiconductor technology node of 90 nm or larger; \n  - a single die of 300 mm2 or larger in any semiconductor technology node; \n  - stacked die packages with die of 300 mm2 or larger, or silicon interposers of 300 mm2 or larger.",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,34,null,"Lead in cermet-based trimmer potentiometer elements",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"form Rev.17L02"]
[null,"* Homogeneous Material :"]
[null,"   \"Homogeneous Material\" means a material that cannot be mechanically disjointed into different materials."]
[null,"   The term \"Homogeneous\" is understood as \"of uniform composition throughout\", so examples of \"Homogeneous Materials\""]
[null,"   would be individual types of plastics, ceramics, glass, metals, alloys, paper, board, resins and coatings."]
[null,"   The term \"mechanically disjointed\" means that the materials can, in principle, be separated by mechanical actions such as"]
[null,"   unscrewing, cutting, crushing, grinding and abrasive processes."]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"[3/3page]"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," 2026/5/25 form"]

{"sheet":"manual(Warranty)","index":1,"n_rows":120,"n_cols":33,"rows_kept":120,"cut":false,"hidden":false,"merged":[[112,1,112,24],[113,1,113,24],[114,1,114,24],[116,1,116,24],[117,1,117,24],[107,3,107,18],[107,20,107,22],[108,1,108,2],[108,3,108,18],[108,20,108,22],[109,1,109,2],[109,3,109,18],[109,20,109,22],[110,1,110,2],[110,3,110,18],[110,20,110,22],[90,19,91,19],[90,20,91,22],[84,3,84,18],[85,1,85,2],[85,3,85,18],[85,20,85,22],[94,1,94,2],[94,3,94,18],[94,20,94,22],[89,20,89,22],[90,3,90,18],[89,1,89,2],[89,3,89,18],[87,1,87,2],[87,3,87,18],[87,20,87,22],[88,1,88,2],[88,3,88,18],[88,20,88,22],[86,20,86,22],[86,1,86,2],[86,3,86,18],[91,3,91,18],[90,1,91,2],[29,2,29,8],[29,9,29,17],[29,18,29,25],[30,2,30,8],[30,9,30,17],[30,18,39,25],[31,2,31,8],[31,9,31,17],[32,2,32,8],[32,9,32,17],[33,2,33,8],[33,9,33,17],[34,2,34,8],[34,9,34,17],[35,2,35,8],[35,9,35,17],[36,2,36,8],[36,9,36,17],[37,2,37,8],[37,9,37,17],[38,2,38,8],[38,9,38,17],[39,2,39,8],[39,9,39,17],[3,20,3,21],[3,22,3,23],[3,24,3,25],[6,2,6,11],[24,2,24,7],[24,8,24,17],[25,2,25,7],[25,8,25,17],[21,2,21,7],[21,8,21,17],[22,2,22,7],[22,8,22,17],[23,2,23,7],[23,8,23,17],[79,1,79,2],[79,3,79,18],[79,20,79,22],[77,1,77,2],[77,3,77,18],[76,1,76,2],[76,3,76,18],[43,3,43,4],[43,5,43,18],[50,2,54,23],[57,1,57,4],[57,5,57,14],[58,1,58,4],[58,5,58,14],[64,1,64,4],[64,5,64,14],[59,1,61,4],[59,5,61,14],[62,1,62,4],[62,5,62,14],[63,1,63,4],[63,5,63,14],[65,1,65,4],[65,5,65,14],[83,3,83,18],[80,1,80,2],[80,3,80,18],[80,20,80,22],[92,1,92,2],[92,3,92,18],[92,20,92,22],[83,1,83,2],[83,20,83,22],[84,1,84,2],[84,20,84,22],[81,1,81,2],[81,3,81,18],[81,20,81,22],[82,1,82,2],[82,3,82,18],[82,20,82,22],[76,20,76,22],[77,20,77,22],[78,1,78,2],[78,3,78,18],[78,20,78,22],[105,1,105,2],[105,3,105,18],[105,20,105,22],[106,1,106,2],[106,3,106,18],[106,20,106,22],[107,1,107,2],[93,1,93,2],[93,3,93,18],[93,20,93,22],[95,1,95,2],[95,3,95,18],[95,20,95,22],[104,1,104,2],[104,3,104,18],[104,20,104,22]]}
[null,"<Steps for Creation>"]
[null,"(1) See the Manual in the separate sheet and enter the data → (2) Run Check Entry below to confirm → (3) Print Warranty"]
[]
[]
[]
[]
[null,"To","PFU Limited",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"PFU Limited"]
[]
[]
[null,null,null,null,null,null,null,null,null,null,null,"Warranty of Compliance with PFU’s Requirement for Chemical Substance (Rev.17L02)"]
[]
[]
[null,"We hereby declare and warrant that  we comply with PFU Limited (\"PFU\")'s Group Standard in supplying PFU Group below listed Product, "]
[null,"even if the Product is altered in any elements as far as the Product remains the same in name and part number."]
[]
[]
[null,"We agree that for the purpose of the above warranty, the terms are defined as follows:"]
[]
[]
[null,"1. PRODUCT"]
[]
[null,null,"Survey ID:",null,null,null,null,null,-1230001]
[null,null,"PFU Group Product Number:",null,null,null,null,null,"PAXXXX1-XXXX"]
[null,null,"Product Name:",null,null,null,null,null,"Power supply unit"]
[null,null,"Manufacturer's P/N  [* Reference]:",null,null,null,null,null,"ABC-0121XX"]
[null,null,"Manufacturer's Name  [* Reference]:",null,null,null,null,null,"CDE Co."]
[]
[null,"2. PFU’S GROUP STANDARD"]
[]
[null,null,"RESTRICTED SUBSTANCES",null,null,null,null,null,null,"THRESHOLD",null,null,null,null,null,null,null,null,"REMARK"]
[null,null," (1) Lead and its compounds",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm",null,null,null,null,null,null,null,null,"Make sure to enter exempted applications in the Item 3."]
[null,null," (2) Mercury and its compounds",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (3) Cadmium and its compounds",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 100 ppm"]
[null,null," (4) Hexavalent chromium compounds",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (5) Polybrominated biphenyls (PBBs)",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (6) Polybrominated diphenyl Ethers (PBDEs)",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (7) Bis(2-ethylhexyl) phthalate (DEHP)",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (8) Butyl benzyl phthalate (BBP)",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (9) Dibutyl phthalate (DBP)",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[null,null," (10) Diisobutyl phthalate (DIBP)",null,null,null,null,null,null," Its concentration in Homogeneous Material(*) shall not exceed 1000 ppm"]
[]
[null,"3. EXEMPTED APPLICATIONS (See Appendix)"]
[]
[null,null,null,"Exempted Applications",null,"7(a),7(c)-I"]
[]
[null,null,null,null,null,"↑Select the cell and double click → the Configuration window opens to enter data. No entry is considered to be no exemptions."]
[null,null,null,null,null,"　 * Direct entry is available. See the Configuration Sheet and the note below."]
[null,null,null,null,null,"　　　・Use half-width alphanumeric. Separate applications with a half-width comma (,) if there is more than one."]
[null,"4. REMARKS"]
[]
[]
[]
[]
[]
[]
[]
[]
[null,"Date (M/D/Y):",null,null,null,"2026-05-25"]
[null,"Person responsible:",null,null,null,"Taro Fuji, Director"]
[null,"Signature: "]
[]
[]
[null,"Department:",null,null,null,"Quality Assurance Dep."]
[null,"Company:",null,null,null,"ABC Corp.　"]
[null,"Phone:",null,null,null,"xxx-xxx-xxxx"]
[null,"E-mail:",null,null,null,"xxxx@xxxxx.xxxxx.xx.xx"]
[]
[]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"[1/2page]"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," 2026/5/25 form"]
[]
[null,"Appendix. EXEMPTED APPLICATIONS FROM CONTAINMENT RESTRICTION (REFERENCE LIST)"]
[]
[null,null,"The following table is quoted from the Official Journal of the European Union."]
[null,null,"For any exempted applications other than below, see the Official Journal."]
[]
[null,"No.",null,"EXEMPTED APPLICATIONS FROM CONTAIMENT RESTRICTION",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Ｐｂ","Ｃｄ"]
[null,"5(b)",null,"Lead in glass of fluorescent tubes not exceeding 0,2 % by weight",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"6(a)-I",null,"Lead as an alloying element in steel for machining purposes containing up to 0,35 % lead by weight",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"6(a)-II",null,"Lead as an alloying element in batch hot-dip galvanised steel components containing up to 0,2 % lead by weight",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"6(b)-III",null,"Lead as an alloying element in aluminium casting alloys containing up to 0,3 % lead by weight provided it stems from lead-bearing aluminium scrap recycling",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"6(c)",null,"Copper alloy containing up to 4 % lead by weight",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)",null,"Lead in high melting temperature type solders \n(i.e. lead-based alloys containing 85 % by weight or more lead)",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-I",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) for internal interconnections for attaching die, or other components along with a die in semiconductor assembly with steady state or transient/impulse currents of 0,1A or greater or blocking voltages beyond 10V, or die edge sizes larger than 0,3mm × 0,3mm",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-II",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) for integral (meaning internal and external) connections of die attach in electrical and electronic components, if all the following conditions are met:\n- the thermal conductivity of the cured/sintered die-attach material is > 35W/(m × K),\n- the electrical conductivity of the cured/sintered die-attach material is > 4,7MS/m,\n- solidus melting temperature is higher than 260°C",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-III",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) in first level solder joints (internal or integral connections - meaning internal and external) for manufacturing components so that subsequent mounting of electronic components onto subassemblies (i.e. modules, sub-circuit boards, substrates, or point-to-point soldering) with a secondary solder does not reflow the first level solder. This sub-entry excludes die attach applications and hermetic sealings",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-IV",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) in second level solder joints for the attachment of components to printed circuit board or lead frames:\n(1)in solder balls for the attachment of ceramic ball-grid- array (BGA);\n(2)in high temperature plastic overmouldings (> 220°C)",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-V",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) as a hermetic sealing material between:\n(1)a ceramic package or plug and a metal case;\n(2)component terminations and an internal sub-part",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-VI",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) for establishing electrical connections between lamp components in incandescent reflector lamps for infrared heating, high intensity discharge lamps, or oven lamps",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(a)-VII",null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) for audio transducers where the peak operating temperature exceeds 200°C",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(c)-I",null,"Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, ",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"e.g. piezoelectronic devices, or in a glass or ceramic matrix compound"]
[null,"7(c)-II",null,"Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(c)-V",null,"Electrical and electronic components containing lead in a glass or glass matrix compound that fulfils any of the following functions: 1) for protection and electrical insulation in glass beads of high-voltage diodes and glass layers for wafers ;2) for hermetic sealing between ceramic, metal and/or glass parts; 3) for bonding purposes in a process parameter window for < 500 °C combined with a viscosity of 1013.3 dPas (‘glass-transition temperature’); 4) for use as a resistive material such as ink, with a resistivity range from 1 ohm/square to 100 megohm/square, excluding trimmer potentiometers; 5) for use in chemically modified glass surfaces for microchannel plates (MCPs), channel electron multipliers (CEMs) and resistive glass products (RGPs).",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"7(c)-VI",null,"Electrical and electronic components containing lead in a ceramic that fulfils any of the following functions: 1) for use in piezoelectric lead zirconium titanate (PZT) ceramics; 2) for providing ceramics with a positive temperature coefficient (PTC).",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"8(b)-I",null,"Cadmium and its compounds in electrical contacts used in: \n  - circuit breakers, \n  - thermal sensing controls, \n  - thermal motor protectors (excluding hermetic thermal motor protectors), \n  - AC switches rated at: \n        - 6 A and more at 250 V AC and more, or \n        - 12 A and more at 125 V AC and more, \n  - DC switches rated at 20 A and more at 18 V DC and more, and \n  - switches for use at voltage supply frequency ≥ 200 Hz.",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"Continued on next page"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"[2/3page]"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," 2026/5/25 form"]
[]
[]
[]
[]
[]
[null,"No.",null,"EXEMPTED APPLICATIONS FROM CONTAIMENT RESTRICTION",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Ｐｂ","Ｃｄ"]
[null,"13(a)",null,"Lead in white glasses used for optical applications",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"13(b)-(I)",null,"Lead in ion coloured optical filter glass types",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"13(b)-(II)",null,"Cadmium in striking optical filter glass types; excluding applications falling under point 39 of this Annex\n* Exclusion number 39 (Excluded unused in this regulation): Cadmium included in color conversion II - VI compound semiconductor LED\n   (cadmiumper mm2 of light emitting area <10 μg) for illumination or display system applications.",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,"13(b)-(III)",null,"Cadmium and Lead in glazes used for reflectance standards",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●","●"]
[null,"15(a)",null,"Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit \nflip chip packages where at least one of the following criteria applies: \n  - a semiconductor technology node of 90 nm or larger; \n  - a single die of 300 mm2 or larger in any semiconductor technology node; \n  - stacked die packages with die of 300 mm2 or larger, or silicon interposers of 300 mm2 or larger.",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,34,null,"Lead in cermet-based trimmer potentiometer elements",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"form Rev.17L02"]
[null,"* Homogeneous Material :"]
[null,"   \"Homogeneous Material\" means a material that cannot be mechanically disjointed into different materials."]
[null,"   The term \"Homogeneous\" is understood as \"of uniform composition throughout\", so examples of \"Homogeneous Materials\""]
[null,"   would be individual types of plastics, ceramics, glass, metals, alloys, paper, board, resins and coatings."]
[null,"   The term \"mechanically disjointed\" means that the materials can, in principle, be separated by mechanical actions such as"]
[null,"   unscrewing, cutting, crushing, grinding and abrasive processes."]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"[3/3page]"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," 2026/5/25 form"]