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[null,"＜作成手順＞"]
[null,"①記載方法（別シート）を参照して記載後に、②「入力チェック」（下記）で確認し、③「適合保証書の印刷」（下記）を行います。"]
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[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"年",null,"月",null,null,null,"日"]
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[null,null,null,null,null,null,null,null,null,null,null,null,"化学物質含有規制適合保証書（Rev.17L02）"]
[]
[]
[null,null,"株式会社PFU",null,null,null,null,null,null,null,null,"宛"]
[]
[null,null,null,null,null,null,null,null,"会社名   　："]
[null,null,null,null,null,null,null,null,"部署名  　 ："]
[null,null,null,null,null,null,null,null,"責任者名　："]
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[null,null,"   当社は、貴社に納入する対象物品（第１項）について、ＰＦＵグループ基準（第２項）に適合していることを保証します。"]
[null,null,"   なお、当社が対象物品の成分変更を行う場合でも引き続き、上記内容を保証します。"]
[]
[]
[null,null,null,null,null,null,null,null,null,null,null,"－　記　－"]
[]
[null,"１．対象物品"]
[]
[null,null,"　調査ＩＤ"]
[null,null,"　ＰＦＵグループ物品番号"]
[null,null,"　物品名称"]
[null,null,"　メーカー型格 [参考]"]
[null,null,"　メーカー名 [参考]"]
[]
[null,"２．ＰＦＵグループ基準"]
[]
[null,null,"　含有規制化学物質（群）",null,null,null,null,null,null,"基準値",null,null,null,null,null,null,null,null,null,"備考"]
[null,null,"　(1) 鉛および鉛化合物",null,null,null,null,null,null,"　均質材料(*)の質量における鉛含有率が1000ｐｐｍを超えない",null,null,null,null,null,null,null,null,null,"含有禁止対象から除外となる\n用途は第３項に記載"]
[null,null,"　(2) 水銀および水銀化合物",null,null,null,null,null,null,"　均質材料(*)の質量における水銀含有率が1000ｐｐｍを超えない"]
[null,null,"　(3) カドミウムおよびカドミウム化合物",null,null,null,null,null,null,"　均質材料(*)の質量におけるカドミウム含有率が 100ｐｐｍを超えない"]
[null,null,"　(4) 六価クロム化合物",null,null,null,null,null,null,"　均質材料(*)の質量におけるクロム含有率が1000ｐｐｍを超えない"]
[null,null,"　(5) ポリ臭化ビフェニル類 (ＰＢB類)",null,null,null,null,null,null,"　均質材料(*)の質量における含有率が1000ｐｐｍを超えない"]
[null,null,"　(6) ポリ臭化ジフェニルエーテル類 (ＰＢＤＥ類) ",null,null,null,null,null,null,"　均質材料(*)の質量における含有率が1000ｐｐｍを超えない"]
[null,null,"　(7) フタル酸ビス（2-エチルヘキシル） (DEHP)",null,null,null,null,null,null,"　均質材料(*)の質量における含有率が1000ｐｐｍを超えない"]
[null,null,"　(8) フタル酸ブチルベンジル (BBP)",null,null,null,null,null,null,"　均質材料(*)の質量における含有率が1000ｐｐｍを超えない"]
[null,null,"　(9) フタル酸ジ－ｎ－ブチル (DBP)",null,null,null,null,null,null,"　均質材料(*)の質量における含有率が1000ｐｐｍを超えない"]
[null,null,"　(10) フタル酸ジイソブチル (DIBP)",null,null,null,null,null,null,"　均質材料(*)の質量における含有率が1000ｐｐｍを超えない"]
[]
[null,"３．含有禁止対象から除外となる用途　（別表参照）"]
[]
[null,null,null,"除外用途"]
[]
[null,null,null,null,null,"　　↑セルをダブルクリック→表示するシート(設定シート)を入力。記入がない場合は「なし」と見なす。"]
[null,null,null,null,null,"　　※直接入力することも可能。直接入力に際しては、シート(設定シート)および下記の注意事項を参照。　"]
[null,null,null,null,null,"　　　　・半角英数字で記入、複数ある場合は半角カンマ(,)で区切る"]
[null,"４．備考"]
[]
[]
[]
[]
[]
[]
[]
[null,"５．担当者"]
[]
[null,null,"部署名"]
[null,null,"担当者名"]
[null,null,"電話番号"]
[null,null,"e-mail"]
[]
[]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"[1/3頁]"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," 2026/5/25 Form改訂"]
[]
[null,"別表．含有禁止対象から除外となる用途選択リスト　（英文を正式とする。）"]
[]
[null,"下表は、欧州連合の官報から引用しています。これ以外は官報を参照してください。"]
[null,"項番",null,"含有禁止対象から除外となる用途　（英文を正式とする）",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Ｐｂ","Cd"]
[null,"5(b)",null,"蛍光管のガラス中の鉛, 0.2wt%以下",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in glass of fluorescent tubes not exceeding 0,2 % by weight"]
[null,"6(a)-I",null,"機械加工用の鋼材に合金成分として含まれる0.35wt%までの鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead as an alloying element in steel for machining purposes containing up to 0,35 % lead by weight"]
[null,"6(a)-II",null,"バッチ式溶融亜鉛めっき鋼中に0.2wt％まで含まれる鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead as an alloying element in batch hot-dip galvanised steel components containing up to 0,2 % lead by weight"]
[null,"6(b)-III",null,"鉛含有アルミニウムスクラップのリサイクルに由来するアルミニウム鋳造合金に合金元素として含まれる0.3重量％までの鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead as an alloying element in aluminium casting alloys containing up to 0,3 % lead by weight provided it stems from lead-bearing aluminium scrap recycling"]
[null,"6(c)",null,"銅合金に含まれる4wt%までの鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Copper alloy containing up to 4 % lead by weight"]
[null,"7(a)",null,"高融点ハンダに含まれる鉛（すなわち鉛含有率が重量で85％以上の鉛ベースの合金）",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)"]
[null,"7(a)-I",null,"定常電流または過渡/インパルス電流が0.1A以上、または阻止電圧が10Vを超える、またはダイのエッジサイズが0.3mm×0.3mmを超える半導体アセンブリ内のダイまたはダイとその他のコンポーネントを取り付けるための内部相互接続用の高融点ハンダ（すなわち鉛含有率が重量で85％以上の鉛ベースの合金）に含まれる鉛。",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) for internal interconnections for attaching die, or other components along with a die in semiconductor assembly with steady state or transient/impulse currents of 0,1A or greater or blocking voltages beyond 10V, or die edge sizes larger than 0,3mm × 0,3mm"]
[null,"7(a)-II",null,"電気・電子部品におけるダイアタッチの一体型（内部および外部を意味する）接続用の高融点はんだ（すなわち、重量比85％以上の鉛を含む鉛系合金）に含まれる鉛について、以下のすべての条件を満たす場合：\n - 硬化／焼結ダイアタッチ材料の熱伝導率が35W/(m×K)を超えること;\n - 硬化／焼結ダイアタッチ材料の電気伝導率が4.7MS/mを超えること;\n - 固相線融点が260℃を超えること",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) for integral (meaning internal and external) connections of die attach in electrical and electronic components, if all the following conditions are met:\n- the thermal conductivity of the cured/sintered die-attach material is > 35W/(m × K),\n- the electrical conductivity of the cured/sintered die-attach material is > 4,7MS/m,\n- solidus melting temperature is higher than 260°C"]
[null,"7(a)-III",null,"電子部品をサブアセンブリ（すなわちモジュール、 サブ回路基板、基板、またはポイント・ツー・ポイント配線）に第二レベルはんだで取り付ける際、第一レベルはんだがリフローしないように部品製造用の第一レベルはんだ接合部（内部または一体型接続-内部および外部を意味する）に使用する高融点はんだ（すなわち、重量比85％以上の鉛を含む鉛ベース合金）に含まれる鉛。本サブ項目はダイアタッチ用途および気密封止を除く。",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) in first level solder joints (internal or integral connections - meaning internal and external) for manufacturing components so that subsequent mounting of electronic components onto subassemblies (i.e. modules, sub-circuit boards, substrates, or point-to-point soldering) with a secondary solder does not reflow the first level solder. This sub-entry excludes die attach applications and hermetic sealings"]
[null,"7(a)-IV",null,"プリント基板またはリードフレームに部品を取り付けるための第二レベルはんだ接合部における高融点はんだ（すなわち、重量比85％以上の鉛を含む鉛ベース合金）に含まれる鉛：\n 1. セラミックボールグリッドアレイ（BGA）の取り付けに使用されるはんだボール;\n 2. 高温プラスチックオーバーモールド（220℃超）中",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) in second level solder joints for the attachment of components to printed circuit board or lead frames:\n(1)in solder balls for the attachment of ceramic ball-grid- array (BGA);\n(2)in high temperature plastic overmouldings (> 220°C)"]
[null,"7(a)-V",null,"下記の間の気密封止材料として使用する高融点はんだ（すなわち、重量比85％以上の鉛を含む鉛系合金）に含まれる鉛：\n 1. セラミックパッケージまたはプラグと金属ケース;\n 2. コンポーネントの端子と内部サブパーツ",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) as a hermetic sealing material between:\n(1)a ceramic package or plug and a metal case;\n(2)component terminations and an internal sub-part"]
[null,"7(a)-VI",null,"赤外線加熱用白熱反射ランプ、高輝度放電ランプ、またはオーブンランプのランプ部品間の電気的接続を確立するための高融点はんだ（すなわち、重量比85％以上の鉛を含む鉛ベース合金）に含まれる鉛。",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) for establishing electrical connections between lamp components in incandescent reflector lamps for infrared heating, high intensity discharge lamps, or oven lamps"]
[null,"7(a)-VII",null,"ピーク動作温度が200℃を超えるオーディオトランスデューサー用の高融点はんだ（すなわち、重量比85％以上の鉛を含む鉛ベース合金）に含まれる鉛。",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) for audio transducers where the peak operating temperature exceeds 200°C"]
[null,"7(c)-I",null,"キャパシタ中の誘電セラミックを除くガラスあるいはセラミック中の電気電子部品に含む鉛、",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"例えばピエゾデバイス、ガラスあるいはセラミックマトリックス化合物"]
[null,null,null,"Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, "]
[null,null,null,"e.g. piezoelectronic devices, or in a glass or ceramic matrix compound"]
[null,"7(c)-II",null,"AC125VあるいはDC250V以上の電圧用のキャパシタ中の誘電セラミックに含まれる鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher"]
[null,"次ページへ続く"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"[2/3頁]"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," 2026/5/25 Form改訂"]
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[null,"項番",null,"含有禁止対象から除外となる用途　（英文を正式とする）",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Ｐｂ","Cd"]
[null,"7(c)-V",null,"ガラスまたはガラスマトリックス化合物に鉛を含み、次のいずれかの機能を果たす電気電子部品:  1) 高電圧ダイオードのガラスビーズおよびウエハー用ガラス層の保護および電気絶縁するためのもの; 2) セラミック、金属、および／またはガラス部品間の気密封止するためのもの; 3) プロセスパラメータウィンドウが500℃未満で粘度が1013.3 dPas（「ガラス転移温度」）の状態での接着するためのもの; 4) トリマーポテンショメータを除く、1オーム/平方から100メガオーム/平方までの抵抗率範囲のインクのような抵抗材料を使用するためのもの; 5) マイクロチャンネルプレート（MCPs）、チャネル電子増倍管（CEMs）、抵抗ガラス製品（RGPs）用の化学修飾ガラス表面に使用するためのもの",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Electrical and electronic components containing lead in a glass or glass matrix compound that fulfils any of the following functions: 1) for protection and electrical insulation in glass beads of high-voltage diodes and glass layers for wafers ;2) for hermetic sealing between ceramic, metal and/or glass parts; 3) for bonding purposes in a process parameter window for < 500 °C combined with a viscosity of 1013.3 dPas (‘glass-transition temperature’); 4) for use as a resistive material such as ink, with a resistivity range from 1 ohm/square to 100 megohm/square, excluding trimmer potentiometers; 5) for use in chemically modified glass surfaces for microchannel plates (MCPs), channel electron multipliers (CEMs) and resistive glass products (RGPs)."]
[null,"7(c)-VI",null,"セラミックに鉛を含む、次のいずれかの機能を果たす電気電子部品: 1) 圧電チタン酸ジルコン酸鉛（PZT）セラミックスを使用するためのもの; 2) 正温度係数（PTC）セラミックスを提供するためのもの",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Electrical and electronic components containing lead in a ceramic that fulfils any of the following functions: 1) for use in piezoelectric lead zirconium titanate (PZT) ceramics; 2) for providing ceramics with a positive temperature coefficient (PTC)."]
[null,"8(b)-I",null,"以下で使用される電気接点中のカドミウムとその化合物\n　・サーキットブレーカー\n　・熱感知制御\n　・サーマルモータープロテクター(密閉型サーマルモータープロテクターを除く)\n　・下記定格のACスイッチ:\n　　　- AC250V以上において6A以上または\n　　　- AC125V以上において12A以上\n　・18V DC以上において20A以上の定格のDCスイッチ\n　・200Hz以上の電圧源周波数において使用するスイッチ",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Cadmium and its compounds in electrical contacts used in: \n　- circuit breakers, \n　- thermal sensing controls, \n　- thermal motor protectors (excluding hermetic thermal motor protectors), \n　- AC switches rated at: \n　　　- 6 A and more at 250 V AC and more, or \n　　　- 12 A and more at 125 V AC and more, \n　- DC switches rated at 20 A and more at 18 V DC and more, and \n　- switches for use at voltage supply frequency ≥ 200 Hz."]
[null,"13(a)",null,"光学機器に使われる白ガラスに含まれる鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in white glasses used for optical applications"]
[null,"13(b)-(I)",null,"イオン着色された光学フィルタガラスタイプ中の鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in ion coloured optical filter glass types"]
[null,"13(b)-(II)",null,"付属書の除外39(*)に該当する用途を除く、ストライキング光学フィルタガラスタイプ中のカドミウム\n* 除外番号39(本規定で未使用の除外)：イルミネーションまたはディスプレイ・システム用途の色変換Ⅱ-Ⅵ族化合物半導体LED\n   (発光領域mm2 あたりのカドミウム＜10μg)に含まれるカドミウム。",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Cadmium in striking optical filter glass types; excluding applications falling under point 39 of this Annex\n* Exclusion number 39 (Excluded unused in this regulation): Cadmium included in color conversion II - VI compound semiconductor LED\n   (cadmiumper mm2 of light emitting area <10 μg) for illumination or display system applications."]
[null,"13(b)-(III)",null,"反射率標準に使用されるフィルタガラスまたはガラス中のカドミウム及び鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●","●"]
[null,null,null,"Cadmium and Lead in glazes used for reflectance standards"]
[null,"15(a)",null,"下記基準の少なくとも一つが当てはまる場合の集積回路パッケージ(フリップチップ)の内部半導体ダイおよびキャリア間における\n確実な電気接続に必要なはんだに含まれる鉛\n　・90ナノメートル半導体テクノロジーノード以上の大きさ\n　・いかなる半導体テクノロジーノードにおいても単一ダイサイズが300mm2以上\n　・300mm2以上のダイまたは300mm2以上のシリコンのインターポーザーを有するスタック型ダイパッケージ",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit \nflip chip packages where at least one of the following criteria applies: \n　- a semiconductor technology node of 90 nm or larger; \n　- a single die of 300 mm2 or larger in any semiconductor technology node; \n　- stacked die packages with die of 300 mm2 or larger, or silicon interposers of 300 mm2 or larger."]
[null,34,null,"サーメット（陶性合金）を主構成要素とするトリマー電位差計構成部品中の鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in cermet-based trimmer potentiometer elements"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"form Rev.17L02"]
[null,"※「均質材料」とは、機械的に別々の材料に分離できない材料を意味する。"]
[null,"　 「均質」という言葉は、「組成全体が均一」として理解されるので、 「均質材料」の例として、プラスチック、セラミック、ガラス、金属、合金、紙、ボード、樹脂、コーティングなどがある。"]
[null," 　「機械的に分離」という言葉は、原則として、ねじの取り外し、切断、粉砕、研削、研磨のプロセスといった機械的行為によって材料が分離されることを意味する。"]
[]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"[3/3頁]"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," 2026/5/25 Form改訂"]

{"sheet":"保証書(記載方法)","index":1,"n_rows":148,"n_cols":33,"rows_kept":148,"cut":false,"hidden":false,"merged":[[125,1,126,2],[125,3,125,21],[125,22,126,22],[125,23,126,25],[126,3,126,21],[82,1,83,2],[82,3,82,21],[82,22,83,22],[82,23,83,25],[83,3,83,21],[123,1,124,2],[123,3,123,21],[123,22,124,22],[123,23,124,25],[124,3,124,21],[102,3,102,21],[103,3,103,21],[104,3,104,21],[105,3,105,21],[106,3,106,21],[102,1,105,2],[102,22,105,22],[102,23,105,25],[106,1,107,2],[106,22,107,22],[106,23,107,25],[107,3,107,21],[98,3,98,21],[99,3,99,21],[100,3,100,21],[98,1,99,2],[98,22,99,22],[98,23,99,25],[100,1,101,2],[100,22,101,22],[100,23,101,25],[101,3,101,21],[94,3,94,21],[95,3,95,21],[96,3,96,21],[94,1,95,2],[94,22,95,22],[94,23,95,25],[96,1,97,2],[96,22,97,22],[96,23,97,25],[97,3,97,21],[88,3,88,21],[89,3,89,21],[90,3,90,21],[91,3,91,21],[92,3,92,21],[88,1,89,2],[88,22,89,22],[88,23,89,25],[90,1,91,2],[90,22,91,22],[90,23,91,25],[92,1,93,2],[92,22,93,22],[92,23,93,25],[93,3,93,21],[84,3,84,21],[85,3,85,21],[86,3,86,21],[84,1,85,2],[84,22,85,22],[84,23,85,25],[86,1,87,2],[86,22,87,22],[86,23,87,25],[87,3,87,21],[78,3,78,21],[79,3,79,21],[80,3,80,21],[78,1,79,2],[78,22,79,22],[78,23,79,25],[80,1,81,2],[80,22,81,22],[80,23,81,25],[81,3,81,21],[54,2,58,26],[62,2,62,3],[62,4,62,20],[47,3,47,4],[47,5,47,20],[76,3,76,21],[63,2,63,3],[63,4,63,20],[64,2,64,3],[64,4,64,20],[65,2,65,3],[65,4,65,20],[75,1,75,2],[75,3,75,21],[75,23,75,25],[76,1,77,2],[76,22,77,22],[76,23,77,25],[77,3,77,21],[39,2,39,8],[39,9,39,18],[40,2,40,8],[40,9,40,18],[41,2,41,8],[41,9,41,18],[42,2,42,8],[42,9,42,18],[43,2,43,8],[43,9,43,18],[3,18,3,20],[3,23,3,24],[3,25,3,26],[3,27,3,28],[27,2,27,8],[27,9,27,26],[28,2,28,8],[28,9,28,26],[25,2,25,8],[25,9,25,26],[26,2,26,8],[26,9,26,26],[21,11,21,13],[8,2,8,10],[10,10,10,28],[11,10,11,28],[12,10,12,28],[127,1,128,2],[127,3,127,21],[127,22,128,22],[127,23,128,25],[128,3,128,21],[122,3,122,21],[122,1,122,2],[122,23,122,25],[29,9,29,26],[29,2,29,8],[33,2,33,8],[33,9,33,18],[33,19,33,27],[34,2,34,8],[34,9,34,18],[34,19,43,27],[35,2,35,8],[35,9,35,18],[36,2,36,8],[36,9,36,18],[37,2,37,8],[37,9,37,18],[38,2,38,8],[38,9,38,18],[129,23,130,25],[130,3,130,21],[131,1,132,2],[131,3,131,21],[131,22,132,22],[131,23,132,25],[132,3,132,21],[142,1,142,27],[143,1,143,27],[135,1,136,2],[135,3,135,21],[135,22,136,22],[135,23,136,25],[136,3,136,21],[137,1,138,2],[133,1,134,2],[133,3,133,21],[133,22,134,22],[133,23,134,25],[134,3,134,21],[129,1,130,2],[129,3,129,21],[129,22,130,22],[144,1,144,27],[137,3,137,21],[137,22,138,22],[137,23,138,25],[138,3,138,21],[139,1,140,2],[139,3,139,21],[139,22,140,22],[139,23,140,25],[140,3,140,21]]}
[null,"＜作成手順＞"]
[null,"①記載方法（本シート）を参照して記載後に、②「入力チェック」（様式シート）で確認し、③「適合保証書の印刷」（様式シート）を行います。"]
[]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,2026,null,null,"年",5,"月",null,25,null,"日"]
[]
[null,null,null,null,null,null,null,null,null,null,null,null,"化学物質含有規制適合保証書（Rev.17L02）"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"株式会社PFU"]
[]
[null,null,"株式会社ＰＦＵ",null,null,null,null,null,null,null,null,"宛"]
[]
[null,null,null,null,null,null,null,null,"会社名   　：",null,"○○○○株式会社"]
[null,null,null,null,null,null,null,null,"部署名  　 ：",null,"品質保証部"]
[null,null,null,null,null,null,null,null,"責任者名　：",null,"質保証部長　　○○　○○"]
[]
[]
[]
[]
[null,null,"   当社は、貴社に納入する対象物品（第１項）について、ＰＦＵグループ基準（第２項）に適合していることを保証します。"]
[null,null,"   なお、当社が対象物品の成分変更を行う場合でも引き続き、上記内容を保証します。"]
[]
[]
[null,null,null,null,null,null,null,null,null,null,null,"－　記　－"]
[]
[null,"１．対象物品"]
[]
[null,null,"　調査ＩＤ",null,null,null,null,null,null,-3001001]
[null,null,"　ＰＦＵグループ物品番号",null,null,null,null,null,null,"PA12345-0001"]
[null,null,"　物品名称",null,null,null,null,null,null,"ケーブル"]
[null,null,"　メーカー型格 [参考]",null,null,null,null,null,null,"ABC-0001"]
[null,null,"　メーカー名 [参考]",null,null,null,null,null,null,"株式会社○○○○"]
[]
[null,"２．ＰＦＵグループ基準"]
[]
[null,null,"　含有規制化学物質（群）",null,null,null,null,null,null,"基準値",null,null,null,null,null,null,null,null,null,"備考"]
[null,null,"　(1) 鉛および鉛化合物",null,null,null,null,null,null,"　均質材料(*)の質量における鉛含有率が1000ｐｐｍを超えない",null,null,null,null,null,null,null,null,null,"含有禁止対象から除外となる\n用途は第３項に記載"]
[null,null,"　(2) 水銀および水銀化合物",null,null,null,null,null,null,"　均質材料(*)の質量における水銀含有率が1000ｐｐｍを超えない"]
[null,null,"　(3) カドミウムおよびカドミウム化合物",null,null,null,null,null,null,"　均質材料(*)の質量におけるカドミウム含有率が 100ｐｐｍを超えない"]
[null,null,"　(4) 六価クロム化合物",null,null,null,null,null,null,"　均質材料(*)の質量におけるクロム含有率が1000ｐｐｍを超えない"]
[null,null,"　(5) ポリ臭化ビフェニル類 (ＰＢB類)",null,null,null,null,null,null,"　均質材料(*)の質量における含有率が1000ｐｐｍを超えない"]
[null,null,"　(6) ポリ臭化ジフェニルエーテル類 (ＰＢＤＥ類) ",null,null,null,null,null,null,"　均質材料(*)の質量における含有率が1000ｐｐｍを超えない"]
[null,null,"　(7) フタル酸ビス（2-エチルヘキシル） (DEHP)",null,null,null,null,null,null,"　均質材料(*)の質量における含有率が1000ｐｐｍを超えない"]
[null,null,"　(8) フタル酸ブチルベンジル (BBP)",null,null,null,null,null,null,"　均質材料(*)の質量における含有率が1000ｐｐｍを超えない"]
[null,null,"　(9) フタル酸ジ－ｎ－ブチル (DBP)",null,null,null,null,null,null,"　均質材料(*)の質量における含有率が1000ｐｐｍを超えない"]
[null,null,"　(10) フタル酸ジイソブチル (DIBP)",null,null,null,null,null,null,"　均質材料(*)の質量における含有率が1000ｐｐｍを超えない"]
[]
[null,"３．含有禁止対象から除外となる用途　（別表参照）"]
[]
[null,null,null,"除外用途",null,"7(a),7(c)-I"]
[]
[null,null,null,null,null,"　　↑セルをダブルクリック→表示するシート(設定シート)を入力。記入がない場合は「なし」と見なす。"]
[null,null,null,null,null,"　　※直接入力することも可能。直接入力に際しては、シート(設定シート)および下記の注意事項を参照。　"]
[null,null,null,null,null,"　　　　・半角英数字で記入、複数ある場合は半角カンマ(,)で区切る"]
[null,"４．備考"]
[]
[]
[]
[]
[]
[]
[]
[null,"５．担当者"]
[]
[null,null,"部署名",null,"品質保証部"]
[null,null,"担当者名",null,"○○　○○"]
[null,null,"電話番号",null,"***-***-****"]
[null,null,"e-mail",null,"****@*****.*****.**.**"]
[]
[]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"[1/3頁]"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," 2026/5/25 Form改訂"]
[]
[]
[null,"別表．含有禁止対象から除外となる用途選択リスト　（英文を正式とする。）"]
[]
[null,"下表は、欧州連合の官報から引用しています。これ以外は官報を参照してください。"]
[null,"項番",null,"含有禁止対象から除外となる用途　（英文を正式とする）",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Ｐｂ","Cd"]
[null,"5(b)",null,"蛍光管のガラス中の鉛, 0.2wt%以下",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in glass of fluorescent tubes not exceeding 0,2 % by weight"]
[null,"6(a)-I",null,"機械加工用の鋼材に合金成分として含まれる0.35wt%までの鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead as an alloying element in steel for machining purposes containing up to 0,35 % lead by weight"]
[null,"6(a)-II",null,"バッチ式溶融亜鉛めっき鋼中に0.2wt％まで含まれる鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead as an alloying element in batch hot-dip galvanised steel components containing up to 0,2 % lead by weight"]
[null,"6(b)-III",null,"鉛含有アルミニウムスクラップのリサイクルに由来するアルミニウム鋳造合金に合金元素として含まれる0.3重量％までの鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead as an alloying element in aluminium casting alloys containing up to 0,3 % lead by weight provided it stems from lead-bearing aluminium scrap recycling"]
[null,"6(c)",null,"銅合金に含まれる4wt%までの鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Copper alloy containing up to 4 % lead by weight"]
[null,"7(a)",null,"高融点ハンダに含まれる鉛（すなわち鉛含有率が重量で85％以上の鉛ベースの合金）",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)"]
[null,"7(a)-I",null,"定常電流または過渡/インパルス電流が0.1A以上、または阻止電圧が10Vを超える、またはダイのエッジサイズが0.3mm×0.3mmを超える半導体アセンブリ内のダイまたはダイとその他のコンポーネントを取り付けるための内部相互接続用の高融点ハンダ（すなわち鉛含有率が重量で85％以上の鉛ベースの合金）に含まれる鉛。",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) for internal interconnections for attaching die, or other components along with a die in semiconductor assembly with steady state or transient/impulse currents of 0,1A or greater or blocking voltages beyond 10V, or die edge sizes larger than 0,3mm × 0,3mm"]
[null,"7(a)-II",null,"電気・電子部品におけるダイアタッチの一体型（内部および外部を意味する）接続用の高融点はんだ（すなわち、重量比85％以上の鉛を含む鉛系合金）に含まれる鉛について、以下のすべての条件を満たす場合：\n - 硬化／焼結ダイアタッチ材料の熱伝導率が35W/(m×K)を超えること;\n - 硬化／焼結ダイアタッチ材料の電気伝導率が4.7MS/mを超えること;\n - 固相線融点が260℃を超えること",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) for integral (meaning internal and external) connections of die attach in electrical and electronic components, if all the following conditions are met:\n- the thermal conductivity of the cured/sintered die-attach material is > 35W/(m × K),\n- the electrical conductivity of the cured/sintered die-attach material is > 4,7MS/m,\n- solidus melting temperature is higher than 260°C"]
[null,"7(a)-III",null,"電子部品をサブアセンブリ（すなわちモジュール、 サブ回路基板、基板、またはポイント・ツー・ポイント配線）に第二レベルはんだで取り付ける際、第一レベルはんだがリフローしないように部品製造用の第一レベルはんだ接合部（内部または一体型接続-内部および外部を意味する）に使用する高融点はんだ（すなわち、重量比85％以上の鉛を含む鉛ベース合金）に含まれる鉛。本サブ項目はダイアタッチ用途および気密封止を除く。",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) in first level solder joints (internal or integral connections - meaning internal and external) for manufacturing components so that subsequent mounting of electronic components onto subassemblies (i.e. modules, sub-circuit boards, substrates, or point-to-point soldering) with a secondary solder does not reflow the first level solder. This sub-entry excludes die attach applications and hermetic sealings"]
[null,"7(a)-IV",null,"プリント基板またはリードフレームに部品を取り付けるための第二レベルはんだ接合部における高融点はんだ（すなわち、重量比85％以上の鉛を含む鉛ベース合金）に含まれる鉛：\n 1. セラミックボールグリッドアレイ（BGA）の取り付けに使用されるはんだボール;\n 2. 高温プラスチックオーバーモールド（220℃超）中",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) in second level solder joints for the attachment of components to printed circuit board or lead frames:\n(1)in solder balls for the attachment of ceramic ball-grid- array (BGA);\n(2)in high temperature plastic overmouldings (> 220°C)"]
[null,"7(a)-V",null,"下記の間の気密封止材料として使用する高融点はんだ（すなわち、重量比85％以上の鉛を含む鉛系合金）に含まれる鉛：\n 1. セラミックパッケージまたはプラグと金属ケース;\n 2. コンポーネントの端子と内部サブパーツ",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) as a hermetic sealing material between:\n(1)a ceramic package or plug and a metal case;\n(2)component terminations and an internal sub-part"]
[null,"7(a)-VI",null,"赤外線加熱用白熱反射ランプ、高輝度放電ランプ、またはオーブンランプのランプ部品間の電気的接続を確立するための高融点はんだ（すなわち、重量比85％以上の鉛を含む鉛ベース合金）に含まれる鉛。",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) for establishing electrical connections between lamp components in incandescent reflector lamps for infrared heating, high intensity discharge lamps, or oven lamps"]
[null,"7(a)-VII",null,"ピーク動作温度が200℃を超えるオーディオトランスデューサー用の高融点はんだ（すなわち、重量比85％以上の鉛を含む鉛ベース合金）に含まれる鉛。",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) for audio transducers where the peak operating temperature exceeds 200°C"]
[null,"7(c)-I",null,"キャパシタ中の誘電セラミックを除くガラスあるいはセラミック中の電気電子部品に含む鉛、",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"例えばピエゾデバイス、ガラスあるいはセラミックマトリックス化合物"]
[null,null,null,"Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, "]
[null,null,null,"e.g. piezoelectronic devices, or in a glass or ceramic matrix compound"]
[null,"7(c)-II",null,"AC125VあるいはDC250V以上の電圧用のキャパシタ中の誘電セラミックに含まれる鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher"]
[null,"次ページへ続く"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"[2/3頁]"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," 2026/5/25 Form改訂"]
[]
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[]
[]
[]
[]
[]
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[]
[null,"項番",null,"含有禁止対象から除外となる用途　（英文を正式とする）",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"Ｐｂ","Cd"]
[null,"7(c)-V",null,"ガラスまたはガラスマトリックス化合物に鉛を含み、次のいずれかの機能を果たす電気電子部品:  1) 高電圧ダイオードのガラスビーズおよびウエハー用ガラス層の保護および電気絶縁するためのもの; 2) セラミック、金属、および／またはガラス部品間の気密封止するためのもの; 3) プロセスパラメータウィンドウが500℃未満で粘度が1013.3 dPas（「ガラス転移温度」）の状態での接着するためのもの; 4) トリマーポテンショメータを除く、1オーム/平方から100メガオーム/平方までの抵抗率範囲のインクのような抵抗材料を使用するためのもの; 5) マイクロチャンネルプレート（MCPs）、チャネル電子増倍管（CEMs）、抵抗ガラス製品（RGPs）用の化学修飾ガラス表面に使用するためのもの",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Electrical and electronic components containing lead in a glass or glass matrix compound that fulfils any of the following functions: 1) for protection and electrical insulation in glass beads of high-voltage diodes and glass layers for wafers ;2) for hermetic sealing between ceramic, metal and/or glass parts; 3) for bonding purposes in a process parameter window for < 500 °C combined with a viscosity of 1013.3 dPas (‘glass-transition temperature’); 4) for use as a resistive material such as ink, with a resistivity range from 1 ohm/square to 100 megohm/square, excluding trimmer potentiometers; 5) for use in chemically modified glass surfaces for microchannel plates (MCPs), channel electron multipliers (CEMs) and resistive glass products (RGPs)."]
[null,"7(c)-VI",null,"セラミックに鉛を含む、次のいずれかの機能を果たす電気電子部品: 1) 圧電チタン酸ジルコン酸鉛（PZT）セラミックスを使用するためのもの; 2) 正温度係数（PTC）セラミックスを提供するためのもの",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Electrical and electronic components containing lead in a ceramic that fulfils any of the following functions: 1) for use in piezoelectric lead zirconium titanate (PZT) ceramics; 2) for providing ceramics with a positive temperature coefficient (PTC)."]
[null,"8(b)-I",null,"以下で使用される電気接点中のカドミウムとその化合物\n　・サーキットブレーカー\n　・熱感知制御\n　・サーマルモータープロテクター(密閉型サーマルモータープロテクターを除く)\n　・下記定格のACスイッチ:\n　　　- AC250V以上において6A以上または\n　　　- AC125V以上において12A以上\n　・18V DC以上において20A以上の定格のDCスイッチ\n　・200Hz以上の電圧源周波数において使用するスイッチ",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Cadmium and its compounds in electrical contacts used in: \n　- circuit breakers, \n　- thermal sensing controls, \n　- thermal motor protectors (excluding hermetic thermal motor protectors), \n　- AC switches rated at: \n　　　- 6 A and more at 250 V AC and more, or \n　　　- 12 A and more at 125 V AC and more, \n　- DC switches rated at 20 A and more at 18 V DC and more, and \n　- switches for use at voltage supply frequency ≥ 200 Hz."]
[null,"13(a)",null,"光学機器に使われる白ガラスに含まれる鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in white glasses used for optical applications"]
[null,"13(b)-(I)",null,"イオン着色された光学フィルタガラスタイプ中の鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in ion coloured optical filter glass types"]
[null,"13(b)-(II)",null,"付属書の除外39(*)に該当する用途を除く、ストライキング光学フィルタガラスタイプ中のカドミウム\n* 除外番号39(本規定で未使用の除外)：イルミネーションまたはディスプレイ・システム用途の色変換Ⅱ-Ⅵ族化合物半導体LED\n   (発光領域mm2 あたりのカドミウム＜10μg)に含まれるカドミウム。",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Cadmium in striking optical filter glass types; excluding applications falling under point 39 of this Annex\n* Exclusion number 39 (Excluded unused in this regulation): Cadmium included in color conversion II - VI compound semiconductor LED\n   (cadmiumper mm2 of light emitting area <10 μg) for illumination or display system applications."]
[null,"13(b)-(III)",null,"反射率標準に使用されるフィルタガラスまたはガラス中のカドミウム及び鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●","●"]
[null,null,null,"Cadmium and Lead in glazes used for reflectance standards"]
[null,"15(a)",null,"下記基準の少なくとも一つが当てはまる場合の集積回路パッケージ(フリップチップ)の内部半導体ダイおよびキャリア間における\n確実な電気接続に必要なはんだに含まれる鉛\n　・90ナノメートル半導体テクノロジーノード以上の大きさ\n　・いかなる半導体テクノロジーノードにおいても単一ダイサイズが300mm2以上\n　・300mm2以上のダイまたは300mm2以上のシリコンのインターポーザーを有するスタック型ダイパッケージ",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit \nflip chip packages where at least one of the following criteria applies: \n　- a semiconductor technology node of 90 nm or larger; \n　- a single die of 300 mm2 or larger in any semiconductor technology node; \n　- stacked die packages with die of 300 mm2 or larger, or silicon interposers of 300 mm2 or larger."]
[null,34,null,"サーメット（陶性合金）を主構成要素とするトリマー電位差計構成部品中の鉛",null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"●"]
[null,null,null,"Lead in cermet-based trimmer potentiometer elements"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"form Rev.17L02"]
[null,"※「均質材料」とは、機械的に別々の材料に分離できない材料を意味する。"]
[null,"　 「均質」という言葉は、「組成全体が均一」として理解されるので、 「均質材料」の例として、プラスチック、セラミック、ガラス、金属、合金、紙、ボード、樹脂、コーティングなどがある。"]
[null," 　「機械的に分離」という言葉は、原則として、ねじの取り外し、切断、粉砕、研削、研磨のプロセスといった機械的行為によって材料が分離されることを意味する。"]
[]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,"[3/3頁]"]
[null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null,null," 2026/5/25 Form改訂"]